Wafer forming process | Wafer fabrication
Achievingultra-flatwaferswithexceptionalsurfacecleanlinessThemonocrystallineingotsmanufacturedbytheCZprocessgothroughfivecarefullycontrolledstepstobecomepolishedwafers.Thefivestepsofwaferforming1.SlicingThecircumferenceofthemonocrystallineingotisgrounddowntoauniformdiameter.Basedontheresistivitydesiredbythecustomer,theingotisthencutintoslicesofaround1mmthickness,usinganinner-diametersaworwiresaw,toformthewafers.2.LappingTheslicedwafersarepolishedbyaluminaabrasiveinalappingmachinetothedesired...
Achieving ultra-flat wafers with exceptional surface cleanliness
The monocrystalline ingots manufactured by the CZ process go through five carefully controlled steps to become polished wafers.
The five steps of wafer forming 1. SlicingThe circumference of the monocrystalline ingot is ground down to a uniform diameter. Based on the resistivity desired by the customer, the ingot is then cut into slices of around 1mm thickness, using an inner-diameter saw or wire saw, to form the wafers.
2. LappingThe sliced wafers are polished by alumina abrasive in a lapping machine to the desired thickness, while improving the surface parallelism.
3. EtchingMechanical damage to the wafer surface resulting from the earlier steps is removed by chemical etching.
4. PolishingThe wafer surfaces are made perfectly flat and given a mirror finish by means of mechano-chemical polishing ...