Semiconductor manufacturing processes | Wafer fabrication
HOME[1]Semiconductormanufacturingprocesses Semiconductormanufacturingprocesses Semiconductordevicesarebuiltupinaseriesofnanofabricationprocessesperformedonthesurfaceofsubstratesmadefromhighlypuresinglecrystalsilicon.Thesesubstratesareusuallyknownaswafers. Commonlyusedwafersincludethe300mmtype,whichofferstheadvancedminiaturizationrequiredforcutting-edgedevices,and200mmtype,whichisbettersuitedtothemixed,smalllotproductionneededfordevicesfortheInternetofThings(Io...
HOME[1]Semiconductor manufacturing processes Semiconductor manufacturing processesSemiconductor devices are built up in a series of nanofabrication processes performed on the surface of substrates made from highly pure single crystal silicon. These substrates are usually known as wafers. Commonly used wafers include the 300 mm type, which offers the advanced miniaturization required for cutting-edge devices, and 200 mm type, which is better suited to the mixed, small lot production needed for devices for the Internet of Things (IoT).
1. Cleaning The silicon wafers forming the base of the semiconductor are cleaned. Even slight contamination of a wafer will cause defects in the circuit. Therefore, chemical agents are used to remove all contamination, from ultra-fine particles to minute amounts of organic or metallic residues generated in the p...