How a semiconductor wafer is made | Wafer process flow
ManufacturingasemiconductorICrequiresasmanyashundredsofmicrofabricationsteps. Thissectionprovidesanoverviewoftheprocessflowofwaferprocessing. Supplementaryinformation»[1] ProcessFlow MieFujitsusemiconductorundertakeswaferprocessingasafoundrycompanytomanufacturesemiconductorICs.Thissectionprovidesanoverviewoftheprocessflowofwaferprocessing. FEOL(FrontEndofLine:substrateprocess,thefirsthalfofwaferprocessing) Componentssuchastransistorsarefo...
Manufacturing a semiconductor IC requires as many as hundreds of microfabrication steps. This section provides an overview of the process flow of wafer processing.
Supplementary information »[1]
Process Flow
Mie Fujitsu semiconductor undertakes wafer processing as a foundry company to manufacture semiconductor ICs. This section provides an overview of the process flow of wafer processing.
FEOL (Front End of Line: substrate process, the first half of wafer processing)Components such as transistors are formed on a silicon substrate.
BEOL (Back End of Line: interconnect process, the second half of wafer processing)Components formed in the FEOL are interconnected with metal material to form circuits.
1. Isolation[2]
Transistors are formed near the silicon w...